Co-packaging photonics and electronics poses challenges

At IEEE’s 74th Electronics and Components Technology Conference (ECTC), Keren Bergman gave a keynote address about different techniques and approaches to bring photonic chips closer to the electrical side, compute and memory, and other components at the edge of the computing system—and we got a chance to chat with her.

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https://www.laserfocusworld.com/optics/article/55042908/co-packaging-photonics-and-electronics-poses-challenges